- Designing for FPC fabrication
- Circuit routing and interconnect configurations (standard geometries or HDI)
- Via interconnect design
- Micro vias
- Blind vias
- Buried vias
- Through hole vias
- Construction / Stack up
- Thick-to-thin transition Zones
- Flexible-to-rigid transition zones
- Layer count, circuit location and bonding schemes
- Panelization to support
- Cost (number up on a panel)
- Assembly
- Electrical test (FPC & FPCA)
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- Designing for FPC assembly
- Selection of appropriate attachment process
- Soldering, ACF/ACA, wire bonding, direct chip attach, etc.
- Pad design for the selected process
- End Metal chips, leaded configurations, land grid array, BGA, LCC, power pad connections, etc.
- Customized bends, folds and reinforcements
- Assembly materials selection
- Custom process development
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